Vol. 2018, Issue 1, 2018October 01, 2018 EDT
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
Lau, John, Ming Li, Yang Lei, Margie Li, Iris Xu, Tony Chen, Qing Xiang Yong, et al. 2018. “Reliability of Fan-Out Wafer-Level Heterogeneous Integration.” IMAPSource Proceedings 2018 (1): 224–32. https://doi.org/10.4071/2380-4505-2018.1.000224.