Reliability of Fan-Out Wafer-Level Heterogeneous Integration

John Lau; Ming Li; Yang Lei; Margie Li; Iris Xu; Tony Chen; Qing Xiang Yong; Zhong Cheng; Wu Kai; Penny Lo; Zhang Li; Kim Hwee Tan; Y. M. Cheung; Nelson Fan; Eric Kuah; Cao Xi; Jiang Ran; Rozalia Beica; Sze Pei Lim; N. C. Lee; C. T. Ko; Henry Yang; Y. H. Chen; Mian Tao; Jeffery Lo; Ricky Lee

doi:10.4071/2380-4505-2018.1.000224

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Lau, John, Ming Li, Yang Lei, Margie Li, Iris Xu, Tony Chen, Qing Xiang Yong, et al. 2018. “Reliability of Fan-Out Wafer-Level Heterogeneous Integration.” IMAPSource Proceedings 2018 (1): 224–32. https://doi.org/10.4071/2380-4505-2018.1.000224.

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