Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Realisation of High Temperature Electronics Packaging Technology for Sensor Conditioning and Processing Applications
Realisation of High Temperature Electronics Packaging Technology for Sensor Conditioning and Processing Applications
Riches, S T, C Johnston, and A Lui. 2012. “Realisation of High Temperature Electronics Packaging Technology for Sensor Conditioning and Processing Applications.” IMAPSource Proceedings 2012 (1): 192–99. https://doi.org/10.4071/isom-2012-TA61.