Vol. 2015, Issue 1, 2015October 01, 2015 EDT
Cost Analysis of Flip Chip Assembly Processes: Mass Reflow with Capillary Underfill and Thermocompression Bonding with Nonconductive Paste
Cost Analysis of Flip Chip Assembly Processes: Mass Reflow with Capillary Underfill and Thermocompression Bonding with Nonconductive Paste
Palesko, Amy. 2015. “Cost Analysis of Flip Chip Assembly Processes: Mass Reflow with Capillary Underfill and Thermocompression Bonding with Nonconductive Paste.” IMAPSource Proceedings 2015 (1): 702–6. https://doi.org/10.4071/isom-2015-THA62.