Process development and material characterization of Cu-Cu thermo-compression bonding (TCB) for high-conductivity electrical interconnects.

Adeel Bajwa; Niteesh Marathe; SivaChandra Jangam; Saptadeep Pal; Ping-Yu Liu; Mark Goorsky; Subramanian S. Iyer

doi:10.4071/isom-2016-WA42

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Bajwa, Adeel, Niteesh Marathe, SivaChandra Jangam, Saptadeep Pal, Ping-Yu Liu, Mark Goorsky, and Subramanian S. Iyer. 2016. “Process Development and Material Characterization of Cu-Cu Thermo-Compression Bonding (TCB) for High-Conductivity Electrical Interconnects.” IMAPSource Proceedings 2016 (1): 203–8. https://doi.org/10.4071/isom-2016-WA42.

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