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Symposium Proceedings
Vol. 2015, Issue 1, 2015
October 01, 2015 EDT
High Density Interposer – Challenges and Opportunities
Mathias Boettcher
,
Frank Windrich
,
M-J. Wolf
,
2.5D/3D wafer level system integration
interposer
micro pillar
redistribution layer
trough silicon via
•
https://doi.org/10.4071/isom-2015-TP23
IMAPSource Conference Papers
Boettcher, Mathias, Frank Windrich, and M-J. Wolf. 2015. “High Density Interposer – Challenges and Opportunities.”
IMAPSource Proceedings
2015 (1): 46–49.
https://doi.org/10.4071/isom-2015-TP23
.
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