Vol. 2010, Issue 1, 2010January 01, 2010 EDT
The reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives for Image Sensor Module Application
The reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives for Image Sensor Module Application
Lee, Chang-Bae, Jin-Gu Kim, Young-Do Kweon, Kyoung-Moo Harr, and Young-Ho Kim. 2010. “The Reliability of COF Joints with Tin Bumps and Non-Conductive Adhesives for Image Sensor Module Application.” IMAPSource Proceedings 2010 (1): 736–41. https://doi.org/10.4071/isom-2010-WP6.
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