Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
Menu
Articles
Ceramics Conference Papers
Device Packaging Conference Presentations
General
High Temperature Conference Papers
IMAPS Chapter Conferences
Symposium Proceedings
All
For Authors
Editorial Board
About
Issues
Journal Micro & Elect Pkg
search
Sorry, something went wrong. Please try your search again.
×
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2010, Issue 1, 2010
January 01, 2010 EDT
Characterization of Black Pad Defect on Electroless Nickel- Immersion Gold (ENIG) Plated Circuits
Adam W. Mortensen
,
Roger M. Devaney
,
Black pad
ENIG
Nickel-phosphorous
lead-free solder
RoHS
•
https://doi.org/10.4071/isom-2010-WP3-Paper1
IMAPSource Conference Papers
Mortensen, Adam W., and Roger M. Devaney. 2010. “Characterization of Black Pad Defect on Electroless Nickel- Immersion Gold (ENIG) Plated Circuits.”
IMAPSource Proceedings
2010 (1): 608–14.
https://doi.org/10.4071/isom-2010-WP3-Paper1
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats