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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Heterogeneous Process Development for Electronic Device Packaging with Direct Printed Additive Manufacturing

R. X. Rodriguez, K. Church, X. Chen,
Additive Manufacturing Printed Circuit Board Direct Print 3D Structure
• https://doi.org/10.4071/isom-2012-WP56
IMAPSource Conference Papers
Rodriguez, R. X., K. Church, and X. Chen. 2012. “Heterogeneous Process Development for Electronic Device Packaging with Direct Printed Additive Manufacturing.” IMAPSource Proceedings 2012 (1): 961–66. https://doi.org/10.4071/isom-2012-WP56.
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