Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Investigating Stress in Hybrid Electronic Packages Using White Light Surface Profilometry
Investigating Stress in Hybrid Electronic Packages Using White Light Surface Profilometry
Folgner, Kelsey A., Ching-Yao Tang, Michael J. O’Brien, and Peter D. Fuqua. 2011. “Investigating Stress in Hybrid Electronic Packages Using White Light Surface Profilometry.” IMAPSource Proceedings 2011 (1): 719–28. https://doi.org/10.4071/isom-2011-WP2-Paper5.