Vol. 2016, Issue 1, 2016October 01, 2016 EDT
The reliability of Ag wedge bonding with various bonding pads for power devices
The reliability of Ag wedge bonding with various bonding pads for power devices
Wei, Xing, Zhou Yu, Ge Yan, Tomonori Iizuka, and Kohei Tatsumi. 2016. “The Reliability of Ag Wedge Bonding with Various Bonding Pads for Power Devices.” IMAPSource Proceedings 2016 (1): 385–89. https://doi.org/10.4071/isom-2016-THA11.