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Symposium Proceedings
Vol. 2017, Issue S1, 2017October 01, 2017 EDT

Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics

Benjamin Leever,
Flexible Hybrid ElectronicsFHEManufacturing EcosystemAdditive ManufacturingFlexible SiliconNextFlex
https://doi.org/10.4071/isom-2017-slide-3
IMAPSource Conference Papers
Leever, Benjamin. 2017. “Electronics Outside the Box: Building a Manufacturing Ecosystem for Flexible Hybrid Electronics.” IMAPSource Proceedings 2017 (S1): 37–80. https:/​/​doi.org/​10.4071/​isom-2017-slide-3.
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