The effect of Cu target pad roughness on the growth mode and void formation in electroless Cu films

Bernhard, Tobias, Sebastian Zarwell, Edith Steinhäuser, Stefan Kempa, and Frank Brüning. 2020. “The Effect of Cu Target Pad Roughness on the Growth Mode and Void Formation in Electroless Cu Films.” IMAPSource Proceedings 2020 (1): 291–97. https://doi.org/10.4071/2380-4505-2020.1.000291.