Vol. 2011, Issue 1, 2011January 01, 2011 EDT
Packaging and Integration Concept for High-Performance and Cost-effective IQM-based Transmitter Module for 160 Gb/s Applications
Packaging and Integration Concept for High-Performance and Cost-effective IQM-based Transmitter Module for 160 Gb/s Applications
Delrosso, G., B. Curran, M. Rothermund, U. Maaß, H. Oppermann, and I. Ndip. 2011. “Packaging and Integration Concept for High-Performance and Cost-Effective IQM-Based Transmitter Module for 160 Gb/s Applications.” IMAPSource Proceedings 2011 (1): 181–88. https://doi.org/10.4071/isom-2011-TA5-Paper6.
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