Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Void formation and bond strength investigated for wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bonding
Void formation and bond strength investigated for wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bonding
Astrid-Sofie B. Vardøy, H.J. van de Wiel, Stian Martinsen, Greg R. Hayes, Hartmut R. Fischer, Knut E. Aasmundtveit, Adriana Lapadatu, Maaike M. V. Taklo,
Vardøy, Astrid-Sofie B., H.J. van de Wiel, Stian Martinsen, Greg R. Hayes, Hartmut R. Fischer, Knut E. Aasmundtveit, Adriana Lapadatu, and Maaike M. V. Taklo. 2013. “Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding.” IMAPSource Proceedings 2013 (1): 717–22. https://doi.org/10.4071/isom-2013-WP44.