Void formation and bond strength investigated for wafer-level Cu-Sn solid-liquid interdiffusion (SLID) bonding

Astrid-Sofie B. Vardøy; H.J. van de Wiel; Stian Martinsen; Greg R. Hayes; Hartmut R. Fischer; Knut E. Aasmundtveit; Adriana Lapadatu; Maaike M. V. Taklo

doi:10.4071/isom-2013-WP44

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Vardøy, Astrid-Sofie B., H.J. van de Wiel, Stian Martinsen, Greg R. Hayes, Hartmut R. Fischer, Knut E. Aasmundtveit, Adriana Lapadatu, and Maaike M. V. Taklo. 2013. “Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding.” IMAPSource Proceedings 2013 (1): 717–22. https://doi.org/10.4071/isom-2013-WP44.

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