Highly Reliable Solderless Contact with Press-fit Technology for Power Modules

Minoru Egusa; Hidetoshi Ishibashi; Yoshitaka Otsubo; Masao Kikuchi; Yoshihiro Kashiba

doi:10.4071/2380-4505-2018.1.000470

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Egusa, Minoru, Hidetoshi Ishibashi, Yoshitaka Otsubo, Masao Kikuchi, and Yoshihiro Kashiba. 2018. “Highly Reliable Solderless Contact with Press-Fit Technology for Power Modules.” IMAPSource Proceedings 2018 (1): 470–75. https://doi.org/10.4071/2380-4505-2018.1.000470.

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