Vol. 2012, Issue 1, 2012January 01, 2012 EDT
Underfill Dispensing for 3D Die Stacking with Through Silicon Vias
Underfill Dispensing for 3D Die Stacking with Through Silicon Vias
Le, Fuliang, S. W. Ricky Lee, Jingshen Wu, and Matthew M. F. Yuen. 2012. “Underfill Dispensing for 3D Die Stacking with Through Silicon Vias.” IMAPSource Proceedings 2012 (1): 548–53. https://doi.org/10.4071/isom-2012-WA13.