Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Package Technology Selection of 28nm High Power FPGA with Pb-Free Solder Bumps: Flip Chip Molded BGA (FCMBGA) versus Traditional Flip Chip Bare Die Package
Package Technology Selection of 28nm High Power FPGA with Pb-Free Solder Bumps: Flip Chip Molded BGA (FCMBGA) versus Traditional Flip Chip Bare Die Package
Lyakas, Michael, Corey Reichman, Miguel Jimarez, Romina Mimi Ocampo, Aaron Elberg, Altaf Hasan, Dierdre Hale, Fred Hamilton, and Joon Dong Kim. 2013. “Package Technology Selection of 28nm High Power FPGA with Pb-Free Solder Bumps: Flip Chip Molded BGA (FCMBGA) versus Traditional Flip Chip Bare Die Package.” IMAPSource Proceedings 2013 (1): 239–44. https://doi.org/10.4071/isom-2013-TP22.
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