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Symposium Proceedings
Vol. 2012, Issue 1, 2012January 01, 2012 EDT

Accurate Prediction of Thermal Resistance of FET by Detailed Modeling of Heat Generation and Backend Stackup

Qun Wan, Don Willis, Daniel Jin,
Thermal ResistanceFETFEAbackend stackuptopologyi Channel current (mALg Gate length (μm)P Heat generation (WmW)pavg Average heat linear density (W/μm)p(x) Heat distribution along channelqavg Average heat area density (W/μm2)q(x) Heat area density along channel (W/μm2)Rth(Tj) Die thermal resistance defined by Tj (°C/W)Rth(Ts) Die thermal resistance defined by Ts as observed in IR measurement (°C/W)tc Channel thickness (nm)Tj Die junction temperature (°C)Tref Reference temperature (°C)Ts Die top surface temperature (°C)Vd Drain voltage (V)Vg Gate voltage (V)Vs Source voltage (V)V(x) Electrical potential along channelx Coordinate along channelwith origin at gate centerα Backend related linear coefficient used to obtain junction temperature from surface temperateΔRth Die thermal resistance difference from junction temperature definition to surface temperature definition (°C/W)ΔTjs Temperature difference between junction and top surface (°C/W)
https://doi.org/10.4071/isom-2012-WP31
IMAPSource Conference Papers
Wan, Qun, Don Willis, and Daniel Jin. 2012. “Accurate Prediction of Thermal Resistance of FET by Detailed Modeling of Heat Generation and Backend Stackup.” IMAPSource Proceedings 2012 (1): 848–56. https:/​/​doi.org/​10.4071/​isom-2012-WP31.
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