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Symposium Proceedings
Vol. 2015, Issue 1, 2015October 01, 2015 EDT

A New In-line Laser-based Acoustic Technique for Pillar Bump Metrology

Todd W. Murray, Andrew Bakir, David M. Stobbe, Michael J. Kotelyanskii, Robin A. Mair, Manjusha Mehendale, Xueping Ru, Jonathan D. Cohen, Michelle T. Schulberg, Priya Mukundhan, Timothy J. Kryman,
Copper pillar bump stacksacoustic metrologyadvanced packaging
https://doi.org/10.4071/isom-2015-WP54
IMAPSource Conference Papers
Murray, Todd W., Andrew Bakir, David M. Stobbe, Michael J. Kotelyanskii, Robin A. Mair, Manjusha Mehendale, Xueping Ru, et al. 2015. “A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology.” IMAPSource Proceedings 2015 (1): 486–92. https:/​/​doi.org/​10.4071/​isom-2015-WP54.
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