Reliability Studies in Advanced Halogen-free Organic Laminates for Ultra-fine Pitch 3D Packaging

Koushik Ramachandran; Fuhan Liu; Nitesh Kumbhat; Baik-Woo Lee; Venky Sundaram; Rao Tummala; Mark Wilson

doi:10.4071/isom-2010-THA3-Paper1

Loading [Contrib]/a11y/accessibility-menu.js

Ramachandran, Koushik, Fuhan Liu, Nitesh Kumbhat, Baik-Woo Lee, Venky Sundaram, Rao Tummala, and Mark Wilson. 2010. “Reliability Studies in Advanced Halogen-Free Organic Laminates for Ultra-Fine Pitch 3D Packaging.” IMAPSource Proceedings 2010 (1): 829–35. https://doi.org/10.4071/isom-2010-THA3-Paper1.

View more stats