Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Wafer Level Package with Y shaped TSV and Vacuum Sealing by Cu-Sn Isothermal Solidification for MEMS Resonator
Wafer Level Package with Y shaped TSV and Vacuum Sealing by Cu-Sn Isothermal Solidification for MEMS Resonator
Cao, Yuhan, and Le Luo. 2010. “Wafer Level Package with Y Shaped TSV and Vacuum Sealing by Cu-Sn Isothermal Solidification for MEMS Resonator.” IMAPSource Proceedings 2010 (1): 707–14. https://doi.org/10.4071/isom-2010-WP5-Paper4.
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