Vol. 2010, Issue 1, 2010January 01, 2010 EDT
Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology
Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology
Bao, Zhongping, and James Burrell. 2010. “Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Applications to 3D TSS Technology.” IMAPSource Proceedings 2010 (1): 170–75. https://doi.org/10.4071/isom-2010-TP1-Paper2.