Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices
Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices
Arnold, Joelle, Steph Gulbrandsen, and Nathan Blattau. 2014. “Impact of Reprocessing Technique on First Level Interconnects of Pb-Free to SnPb Reballed Area Array Flip Chip Devices.” IMAPSource Proceedings 2014 (1): 112–16. https://doi.org/10.4071/isom-TA43.
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