Effects on the Reliability of Lead-Free Solder Joints under Harsh Environment

Hai, Zhou, Jiawei Zhang, Chaobo Shen, Cong Zhao, John L. Evans, and Micheal. J. Bozack. 2014. “Effects on the Reliability of Lead-Free Solder Joints under Harsh Environment.” IMAPSource Proceedings 2014 (1): 471–76. https://doi.org/10.4071/isom-WA41.