Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Wafer Dicing Using Dry Etching on Standard Tapes and Frames
Wafer Dicing Using Dry Etching on Standard Tapes and Frames
Lishan, David, Thierry Lazerand, Kenneth Mackenzie, David Pays-Volard, Linnell Martinez, Gordy Grivna, Jason Doub, Ted Tessier, and Guy Burgess. 2014. “Wafer Dicing Using Dry Etching on Standard Tapes and Frames.” IMAPSource Proceedings 2014 (1): 148–54. https://doi.org/10.4071/isom-TA56.