ISSN 2380-4505
Vol. 2014, Issue 1, 2014January 01, 2014 EDT
A Novel Thin Wafer Handling Technology to Enable Cost-Effective Fabrication of Through-Glass Via Interposers
A Novel Thin Wafer Handling Technology to Enable Cost-Effective Fabrication of Through-Glass Via Interposers
Alvin Lee, Jay Su, Kim Arnold, Dongshun Bai, Bor Kai Wang, Leon Tsai, Aric Shorey, Wen-Wei Shen, Chun-Hsien Chien, Hsiang-Hung Chang, Jen-Chun Wang,
Lee, Alvin, Jay Su, Kim Arnold, Dongshun Bai, Bor Kai Wang, Leon Tsai, Aric Shorey, et al. 2014. “A Novel Thin Wafer Handling Technology to Enable Cost-Effective Fabrication of Through-Glass Via Interposers.” IMAPSource Proceedings 2014 (1): 724–28. https://doi.org/10.4071/isom-WP44.