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Symposium Proceedings
Vol. 2014, Issue 1, 2014
January 01, 2014 EDT
High Resolution Patterning Technology to enable Panel Based Advanced Packaging
Klaus Ruhmer
,
Philippe Cochet
,
Roger McCleary
,
Nelson Chen
,
2.5D Interposer
3D
Advanced Packaging Lithography
Fan-Out Packaging
Panel based Advanced Packaging
RDL
Redistribution Layer
Stepper
TGV
Through Glass Via
TSV
Through-Silicon-Via
•
https://doi.org/10.4071/isom-TA53
IMAPSource Conference Papers
Ruhmer, Klaus, Philippe Cochet, Roger McCleary, and Nelson Chen. 2014. “High Resolution Patterning Technology to Enable Panel Based Advanced Packaging.”
IMAPSource Proceedings
2014 (1): 129–36.
https://doi.org/10.4071/isom-TA53
.
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