Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Reliability Study of Silver, Copper and Gold Wire Bonding on IC Device
Reliability Study of Silver, Copper and Gold Wire Bonding on IC Device
Gao, Hongtao, Jun Lu, Richard Lu, Wei Xin, Xiaojing Xu, and Hamza Yilmaz. 2014. “Reliability Study of Silver, Copper and Gold Wire Bonding on IC Device.” IMAPSource Proceedings 2014 (1): 850–55. https://doi.org/10.4071/isom-THP33.