Reliability Study of Silver, Copper and Gold Wire Bonding on IC Device

Hongtao Gao; Jun Lu; Richard Lu; Wei Xin; Xiaojing Xu; Hamza Yilmaz

doi:10.4071/isom-THP33

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Gao, Hongtao, Jun Lu, Richard Lu, Wei Xin, Xiaojing Xu, and Hamza Yilmaz. 2014. “Reliability Study of Silver, Copper and Gold Wire Bonding on IC Device.” IMAPSource Proceedings 2014 (1): 850–55. https://doi.org/10.4071/isom-THP33.

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