Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Z-Interconnect Technology - A Reliable, Cost Efficient Solution for High Density, High Performance Electronic Packaging
Z-Interconnect Technology - A Reliable, Cost Efficient Solution for High Density, High Performance Electronic Packaging
Lauffer, John M., and Kevin Knadle. 2014. “Z-Interconnect Technology - A Reliable, Cost Efficient Solution for High Density, High Performance Electronic Packaging.” IMAPSource Proceedings 2014 (1): 141–47. https://doi.org/10.4071/isom-TA55.