ISSN 2380-4505
Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Development of a stress compensation layer for thin pixel modules 3D assembly
Development of a stress compensation layer for thin pixel modules 3D assembly
Pares, G., T. McMullen, S. Tomé, L. Vignoud, R. Bates, and C. Buttar. 2014. “Development of a Stress Compensation Layer for Thin Pixel Modules 3D Assembly.” IMAPSource Proceedings 2014 (1): 787–93. https://doi.org/10.4071/isom-THP13.