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Symposium Proceedings
Vol. 2014, Issue 1, 2014January 01, 2014 EDT

Development of Glass Interposer with Fine-Pitch Micro Bumps and Warpage Study Depending on Several Glass Substrates with Different CTE’s

Kenichi Mori, Naoyuki Koizumi, Kei Murayama, Mitsuhiro Aizawa, Koji Nagai, Toshinori Koyama,
Chip Last Process CTE Glass-Interposer warpage
• https://doi.org/10.4071/isom-WA12
IMAPSource Conference Papers
Mori, Kenichi, Naoyuki Koizumi, Kei Murayama, Mitsuhiro Aizawa, Koji Nagai, and Toshinori Koyama. 2014. “Development of Glass Interposer with Fine-Pitch Micro Bumps and Warpage Study Depending on Several Glass Substrates with Different CTE’s.” IMAPSource Proceedings 2014 (1): 382–87. https://doi.org/10.4071/isom-WA12.
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