Vol. 2014, Issue 1, 2014January 01, 2014 EDT
One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing
One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing
Duffy, Daniel J., Lin Xin, Jean Liu, and Bruno Tolla. 2014. “One Step Chip Attach Materials (OSCA) for Conventional Mass Reflow Processing.” IMAPSource Proceedings 2014 (1): 262–67. https://doi.org/10.4071/isom-TP35.