Vol. 2014, Issue 1, 2014January 01, 2014 EDT
Parametric Studies of Effects of Solder Bump Pitch, Package Size, and Molding Compound and Substrate Thicknesses on Warpage of PBGA Packages
Parametric Studies of Effects of Solder Bump Pitch, Package Size, and Molding Compound and Substrate Thicknesses on Warpage of PBGA Packages
Kang, Sungbum, and I. Charles Ume. 2014. “Parametric Studies of Effects of Solder Bump Pitch, Package Size, and Molding Compound and Substrate Thicknesses on Warpage of PBGA Packages.” IMAPSource Proceedings 2014 (1): 44–49. https://doi.org/10.4071/isom-TA23.