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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION
Woo Han Young
,
Mike Marshall
,
Advanced packaging
bump metrology
defect inspection
FOWLP
•
https://doi.org/10.4071/2380-4505-2019.1.000260
IMAPSource Conference Papers
Young, Woo Han, and Mike Marshall. 2019. “IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION.”
IMAPSource Proceedings
2019 (1): 260–67.
https://doi.org/10.4071/2380-4505-2019.1.000260
.
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