Loading [Contrib]/a11y/accessibility-menu.js
IMAPSource Conference Papers
  • Menu
  • Articles
    • Ceramics Conference Papers
    • Device Packaging Conference Presentations
    • General
    • High Temperature Conference Papers
    • IMAPS Chapter Conferences
    • Symposium Proceedings
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • Journal Micro & Elect Pkg
  • search

    Sorry, something went wrong. Please try your search again.
    ×

    • Articles
    • Blog posts

RSS Feed

Enter the URL below into your favorite RSS reader.

https://imapsource.org/feed
×
Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION

Woo Han Young, Mike Marshall,
Advanced packaging bump metrology defect inspection FOWLP
• https://doi.org/10.4071/2380-4505-2019.1.000260
IMAPSource Conference Papers
Young, Woo Han, and Mike Marshall. 2019. “IMPROVE CONTROL AMIDST DIE SHRINKAGE AND 3D PACKAGE COMPLICATION.” IMAPSource Proceedings 2019 (1): 260–67. https://doi.org/10.4071/2380-4505-2019.1.000260.
Save article as...▾
  • PDF
  • XML
  • Citation (BibTeX)

View more stats

Powered by Scholastica, the modern academic journal management system