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Symposium Proceedings
Vol. 2019, Issue 1, 2019
October 01, 2019 EDT
Low Profile and Large Size WLCSP in IoT Applications
Tom Tang
,
Kuei Hsiao Kuo
,
Victor Lin
,
Kelly Chen
,
J.Y. Chen
,
B.H. Ma
,
Yu-Po Wang
,
Wafer level chip scale package (WLCSP)
board level reliability
laser grooving process
wafer grinding process
wafer warpage
•
https://doi.org/10.4071/2380-4505-2019.1.000327
IMAPSource Conference Papers
Tang, Tom, Kuei Hsiao Kuo, Victor Lin, Kelly Chen, J.Y. Chen, B.H. Ma, and Yu-Po Wang. 2019. “Low Profile and Large Size WLCSP in IoT Applications.”
IMAPSource Proceedings
2019 (1): 327–32.
https://doi.org/10.4071/2380-4505-2019.1.000327
.
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