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ISSN 2380-4505
Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Low Profile and Large Size WLCSP in IoT Applications

Tom Tang, Kuei Hsiao Kuo, Victor Lin, Kelly Chen, J.Y. Chen, B.H. Ma, Yu-Po Wang,
Wafer level chip scale package (WLCSP)board level reliabilitylaser grooving processwafer grinding processwafer warpage
https://doi.org/10.4071/2380-4505-2019.1.000327
IMAPSource Conference Papers
Tang, Tom, Kuei Hsiao Kuo, Victor Lin, Kelly Chen, J.Y. Chen, B.H. Ma, and Yu-Po Wang. 2019. “Low Profile and Large Size WLCSP in IoT Applications.” IMAPSource Proceedings 2019 (1): 327–32. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000327.

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