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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Characterization and Electrical Performance of Glass Diplexer Modules

Charles Woychik, John Lauffer, Scott Pollard, Raj Parmar, Michael Gaige, William Wilson, James Carey, Matthew Neely, Feng Ling, Lijun Chen,
Glass interposerthrough glass via (TGV)semi-additive plating (SAP)electrically conductive adhesive (ECA)
https://doi.org/10.4071/2380-4505-2019.1.000393
IMAPSource Conference Papers
Woychik, Charles, John Lauffer, Scott Pollard, Raj Parmar, Michael Gaige, William Wilson, James Carey, Matthew Neely, Feng Ling, and Lijun Chen. 2019. “Characterization and Electrical Performance of Glass Diplexer Modules.” IMAPSource Proceedings 2019 (1): 393–97. https:/​/​doi.org/​10.4071/​2380-4505-2019.1.000393.
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