Flip Chip Underfill RF Characterization

Robert B. Paul; A. Ege Engin; Jerry Aguirre

doi:10.4071/2380-4505-2019.1.000243

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Paul, Robert B., A. Ege Engin, and Jerry Aguirre. 2019. “Flip Chip Underfill RF Characterization.” IMAPSource Proceedings 2019 (1): 243–47. https://doi.org/10.4071/2380-4505-2019.1.000243.

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