ISSN 2380-4505
Vol. 2019, Issue 1, 2019October 01, 2019 EDT
Optimizing the Within Wafer Non-Uniformity at the Chemical Mechanical Planarization step in Interposers and RDL fabrication process for 3D IC stacking
Optimizing the Within Wafer Non-Uniformity at the Chemical Mechanical Planarization step in Interposers and RDL fabrication process for 3D IC stacking
Kumar, Amit, Jose Chacon, Peter Gelzinis, and Ankineedu Velaga. 2019. “Optimizing the Within Wafer Non-Uniformity at the Chemical Mechanical Planarization Step in Interposers and RDL Fabrication Process for 3D IC Stacking.” IMAPSource Proceedings 2019 (1): 450–53. https://doi.org/10.4071/2380-4505-2019.1.000450.