Cu pillar bump development for 7nm Chip package interaction (CPI) technology

Lei Fu; Milind Bhagavat; Cheryl Selvanayagam; Ken Leong; Ivor Barber

doi:10.4071/2380-4505-2019.1.000176

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Fu, Lei, Milind Bhagavat, Cheryl Selvanayagam, Ken Leong, and Ivor Barber. 2019. “Cu Pillar Bump Development for 7nm Chip Package Interaction (CPI) Technology.” IMAPSource Proceedings 2019 (1): 176–82. https://doi.org/10.4071/2380-4505-2019.1.000176.

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