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Symposium Proceedings
Vol. 2019, Issue 1, 2019October 01, 2019 EDT

Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study

T. Bernhard, L. Gregoriades, S. Branagan, L. Stamp, E. Steinhäuser, R. Schulz, F. Brüning,
PCB reliability voids electroless Cu stacked vias
• https://doi.org/10.4071/2380-4505-2019.1.000492
IMAPSource Conference Papers
Bernhard, T., L. Gregoriades, S. Branagan, L. Stamp, E. Steinhäuser, R. Schulz, and F. Brüning. 2019. “Nanovoid Formation at Cu/Cu/Cu Interconnections of Blind Microvias: A Field Study.” IMAPSource Proceedings 2019 (1): 492–502. https://doi.org/10.4071/2380-4505-2019.1.000492.
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