Vol. 2013, Issue 1, 2013January 01, 2013 EDT
Scaling Challenges of Semiconductor Packaging in the Era of Big Data
Scaling Challenges of Semiconductor Packaging in the Era of Big Data
Orii, Yasumitsu, Akihiro Horibe, Kazushige Toriyama, Keiji Matsumoto, Hirokazu Noma, Sayuri Kohara, Toyohiro Aoki, Kuniaki Sueoka, and Hiroyuki Mori. 2013. “Scaling Challenges of Semiconductor Packaging in the Era of Big Data.” IMAPSource Proceedings 2013 (1): 402–7. https://doi.org/10.4071/isom-2013-TP63.