A friction based approach for modeling wire bonding

Simon Althoff; Jan Neuhaus; Tobias Hemsel; Walter Sextro

doi:10.4071/isom-2013-TA67

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Althoff, Simon, Jan Neuhaus, Tobias Hemsel, and Walter Sextro. 2013. “A Friction Based Approach for Modeling Wire Bonding.” IMAPSource Proceedings 2013 (1): 208–12. https://doi.org/10.4071/isom-2013-TA67.

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