Thermal Evaluation of High-Current Polyimide Rigid and Rigid-Flex Printed Wiring Board Trace Widths in a Vacuum

Bennion Cannon; Frank Friedl; Gary Gisler

doi:10.4071/isom-2013-THP64

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Cannon, Bennion, Frank Friedl, and Gary Gisler. 2013. “Thermal Evaluation of High-Current Polyimide Rigid and Rigid-Flex Printed Wiring Board Trace Widths in a Vacuum.” IMAPSource Proceedings 2013 (1): 964–69. https://doi.org/10.4071/isom-2013-THP64.

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