Thick Copper and Aluminum Wire Bonding Technology for High Power Laser Devices

Kong Weng Lee; Lei Xu; Jay Skidmore

doi:10.4071/isom-2013-TP46

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Lee, Kong Weng, Lei Xu, and Jay Skidmore. 2013. “Thick Copper and Aluminum Wire Bonding Technology for High Power Laser Devices.” IMAPSource Proceedings 2013 (1): 336–40. https://doi.org/10.4071/isom-2013-TP46.

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