Thick Copper and Aluminum Wire Bonding Technology for High Power Laser Devices

Lee, Kong Weng, Lei Xu, and Jay Skidmore. 2013. “Thick Copper and Aluminum Wire Bonding Technology for High Power Laser Devices.” IMAPSource Proceedings 2013 (1): 336–40. https:/​/​doi.org/​10.4071/​isom-2013-TP46.