Effect of Voiding in Solder Joints on Thermal Performance of the LED

Jianbiao Pan

doi:10.4071/isom-2013-THP46

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Pan, Jianbiao. 2013. “Effect of Voiding in Solder Joints on Thermal Performance of the LED.” IMAPSource Proceedings 2013 (1): 895–901. https://doi.org/10.4071/isom-2013-THP46.

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