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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds

Varughese Mathew, Sheila Chopin, Leo Higgins, Yingrui Zhang,
Copper wirebond Corrosion Cu-Al integrity Mold compounds Reliability
• https://doi.org/10.4071/isom-2013-TA35
IMAPSource Conference Papers
Mathew, Varughese, Sheila Chopin, Leo Higgins, and Yingrui Zhang. 2013. “Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds.” IMAPSource Proceedings 2013 (1): 89–93. https://doi.org/10.4071/isom-2013-TA35.
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