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Symposium Proceedings
Vol. 2013, Issue 1, 2013
January 01, 2013 EDT
Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds
Varughese Mathew
,
Sheila Chopin
,
Leo Higgins
,
Yingrui Zhang
,
Copper wirebond
Corrosion
Cu-Al integrity
Mold compounds
Reliability
•
https://doi.org/10.4071/isom-2013-TA35
IMAPSource Conference Papers
Mathew, Varughese, Sheila Chopin, Leo Higgins, and Yingrui Zhang. 2013. “Copper Wirebond Compatibility with Organic and Inorganic Ions Present in Mold Compounds.”
IMAPSource Proceedings
2013 (1): 89–93.
https://doi.org/10.4071/isom-2013-TA35
.
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