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ISSN 2380-4505
Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Analysis of stress/strain in Electroless Copper Films

Tobias Bernhard, Simon Bamberg, Frank Brüning, Ralf Brüning, Laurence J. Gregoriades, Tanu Sharma, Delilah Brown, M. Klaus, Ch. Genzel,
stressstrainelectroless copper filmspolymer substratescopper bathselectroless cublisteringdelamination
https://doi.org/10.4071/isom-2013-TA17
IMAPSource Conference Papers
Bernhard, Tobias, Simon Bamberg, Frank Brüning, Ralf Brüning, Laurence J. Gregoriades, Tanu Sharma, Delilah Brown, M. Klaus, and Ch. Genzel. 2013. “Analysis of Stress/Strain in Electroless Copper Films.” IMAPSource Proceedings 2013 (1): 26–30. https:/​/​doi.org/​10.4071/​isom-2013-TA17.

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