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Symposium Proceedings
Vol. 2013, Issue 1, 2013January 01, 2013 EDT

Modeling and Reliability Analysis of TSVs for High Frequency Applications

Kaushal Kannan, Bruce Kim, Sukeshwar Kannan, Seok-Ho Noh,
Fault modelinghigh frequency applicationsS-parameter simulationsthermo-mechanical delaminationsthrough silicon via (TSV)
https://doi.org/10.4071/isom-2013-TP23
IMAPSource Conference Papers
Kannan, Kaushal, Bruce Kim, Sukeshwar Kannan, and Seok-Ho Noh. 2013. “Modeling and Reliability Analysis of TSVs for High Frequency Applications.” IMAPSource Proceedings 2013 (1): 245–49. https:/​/​doi.org/​10.4071/​isom-2013-TP23.
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