Smart Power Module Molding Advances: Evaluating high temperature suitability of Molding Compounds

K.-F. Becker; T. Thomas; J. Bauer; R. Kahle; T. Braun; R. Aschenbrenner; M. Schneider-Ramelow; K.-D. Lang

doi:10.4071/isom-2013-TA62

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Becker, K.-F., T. Thomas, J. Bauer, R. Kahle, T. Braun, R. Aschenbrenner, M. Schneider-Ramelow, and K.-D. Lang. 2013. “Smart Power Module Molding Advances: Evaluating High Temperature Suitability of Molding Compounds.” IMAPSource Proceedings 2013 (1): 177–82. https://doi.org/10.4071/isom-2013-TA62.

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