3D Integration of System-in-Package (SiP) Using Organic Interposer: Toward SiP-Interposer-SiP for High-End Electronics

Rabindra N. Das; Frank D. Egitto; Steven G. Rosser; Erich Kopp; Barry Bonitz; Raj Rai

doi:10.4071/isom-2013-WA43

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Das, Rabindra N., Frank D. Egitto, Steven G. Rosser, Erich Kopp, Barry Bonitz, and Raj Rai. 2013. “3D Integration of System-in-Package (SiP) Using Organic Interposer: Toward SiP-Interposer-SiP for High-End Electronics.” IMAPSource Proceedings 2013 (1): 531–37. https://doi.org/10.4071/isom-2013-WA43.

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